MWI 15-12A6K
IGBTs
Ratings
Symbol
V CES
V GES
V GEM
I C25
I C80
P tot
Definitions
collector emitter voltage
max. DC gate voltage
max. transient collector gate voltage
collector current
total power dissipation
Conditions
continuous
transient
T VJ = 25°C to  50°C
T C = 25°C
T C = 80°C
T C = 25°C
min.
typ.
max.
 200
±20
±30
 9
 3
90
Unit
V
V
V
A
A
W
V CE(sat)
V GE(th)
I CES
collector emitter saturation voltage
gate emitter threshold voltage
collector emitter leakage current
I C =  5 A; V GE =  5 V
I C = 0.35 mA; V GE = V CE
V CE = V CES ; V GE = 0 V
T VJ = 25°C
T VJ =  25°C
T VJ = 25°C
T VJ = 25°C
T VJ =  25°C
4.5
3.0
3.5
0.8
3.4
6.5
0.9
V
V
V
mA
mA
I GES
C ies
Q G(on)
gate emitter leakage current
input capacitance
total gate charge
V CE = 0 V; V GE = ±20 V
V CE = 25 V; V GE = 0 V; f =   MHz
V CE = 600 V; V GE =  5 V; I C =  0 A
600
45
 00
nA
pF
nC
t d(on)
t r
t d(off)
t f
E on
E off
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load
V CE = 600 V; I C =  0 A
V GE = ± 5 V; R G = 82 W
T VJ =  25°C
50
40
290
60
 .2
 . 
ns
ns
ns
ns
mJ
mJ
I CM
reverse bias safe operating area
RBSOA; V GE = ± 5 V; R G = 82 W
L =  00 μH; clamped induct. load T VJ =  25°C
V CEmax = V CES - L S · di/dt
30
A
t SC
(SCSOA)
R thJC
R thCH
short circuit safe operating area
thermal resistance junction to case
thermal resistance case to heatsink
V CE =  200 V; V GE = ± 5 V;
R G = 82 W ; non-repetitive
(per IGBT)
(per IGBT)
T VJ =  25°C
 0
0.5
 .37
μs
K/W
K/W
Diodes
Ratings
Symbol
V RRM
I F25
I F80
V F
I RM
t rr
E rec(off)
Definitions
max. repetitve reverse voltage
forward current
forward voltage
max. reverse recovery current
reverse recovery time
reverse recovery energy
Conditions
I F =  5 A; V GE = 0 V
V R = 600 V
di F /dt = -400 A/μs
I F =  5 A; V GE = 0 V
T VJ =  50°C
T C = 25°C
T C = 80°C
T VJ = 25°C
T VJ =  25°C
T VJ =  25°C
min.
typ.
2.4
 .7
 6
 30
tbd
max.
 200
24
 6
2.7
Unit
V
A
A
V
V
A
ns
μJ
R thJC
R thCH
thermal resistance junction to case
thermal resistance case to heatsink
(per diode)
(per diode)
0.55
 .6
K/W
K/W
T C = 25°C unless otherwise stated
IXYS reserves the right to change limits, test conditions and dimensions.
? 2007 IXYS All rights reserved
2007   3a
2-4
相关PDF资料
MWI15-12A7 MOD IGBT SIXPACK RBSOA 1200V E2
MWI150-06A8 TRANS 16BIY 3-PH 600V 115AMP
MWI150-12T8T MOD IGBT TRENCH SIXPACK E3
MWI200-06A8 TRANS 16BIT 3-PH 600V 115A
MWI25-12A7T MOD IGBT SIXPACK RBSOA 1200V E2
MWI30-06A7T MOD IGBT SIXPACK RBSOA 600V E2
MWI35-12A7 MOD IGBT SIXPACK RBSOA 1200V E2
MWI45-12T6K MOD IGBT SIXPACK RBSOA 1200V E1
相关代理商/技术参数
MWI15-12A7 功能描述:分立半导体模块 15 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI200-06A4 制造商:n/a 功能描述:IGBT Module
MWI200-06A8 功能描述:分立半导体模块 NPT IGBT 600V, 200A RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI200-06A8T 功能描述:分立半导体模块 200 Amps 600V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI225-12E9 功能描述:分立半导体模块 225 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI225-17E9 功能描述:分立半导体模块 225 Amps 1700V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI25-12A7 功能描述:分立半导体模块 25 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MWI25-12A7T 功能描述:IGBT 模块 25 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装: